Pushing the Boundaries
of Wafer DicingAA Diamond technology Co.,Ltd.
Pushing the Boundaries
of Wafer DicingAA Diamond technology Co.,Ltd.
Pushing the Boundaries
of Wafer DicingAA Diamond technology Co.,Ltd
Pushing the Boundaries
of Wafer DicingAA Diamond technology Co.,Ltd
Introduction
AA diamond technology Co.,Ltd. was founded in May 2025 as a joint venture between Asahi Diamond Industrial Co.,Ltd. and TOKYO SEIMITSU CO., LTD.
By combining Asahi Diamond's advanced diamond tool development capabilities with Tokyo Seimitsu's expertise in dicing applications, we manufacture and market hub blades that deliver high quality while remaining cost-competitive.
News
2026-08-31
Product
Applicable to the dicing of various types of wafers.
Company Profile
Company name
AA Diamond technology CO.,LTD.
Established
May 9, 2025
Paid-in capital
1,000 million yen
Shareholding Ratio
Tokyo Seimitsu: 50% Asahi Diamond: 50%
Location
787, Tabi, Ichihara-shi, Chiba 290-0515, Japan
MapTelephone
81 (436) 77-6406
Facsimile
81 (436) 77-6126